Novel Spatially Arranged Mixed Carbon Nanotube Bundle Interconnects - Impact on Delay and Power


Microelectronics and VLSI Group,Department of Electronics and Communication Engineering, Indian Institute of Technology Roorkee, Roorkee – 247667,Dist. – Haridwar, Uttarakhand, INDIA


This research paper introduces novel structures of mixed CNT bundle (MCB) based non-conventional arrangements of single- and multi-walled carbon nanotubes. Hierarchical equivalent single conductor (ESC) model is used to analyze the propagation delay and power dissipation of CNT bundles. The hierarchical model of MCB considers two types of CNTs, one single-walled CNT (SWCNT) and other multi-walled CNT (MWCNT). ESCmodel of MCB is the combination of ESC models of bundled SWCNT and bundled MWCNT. Initially, simple ESC models of bundled SWCNT and bundled MWCNT are derived considering the parasitic elements like resistance, capacitance and inductance. Later on, these two equivalent models are combined to build up the final ESC model of novel MCBs. It has been observed that the overall delay and power dissipation are reduced by 48.1% and 20.9% respectively for the novel MCB that has horizontal arrangement of SWCNTs and MWCNTs in equal halves.